![]({"xsmall":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.100.100.384,0,1536,1152.file/crossbeam_links.png","small":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.360.360.384,0,1536,1152.file/crossbeam_links.png","medium":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.768.768.384,0,1536,1152.file/crossbeam_links.png","large":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.1024.1024.384,0,1536,1152.file/crossbeam_links.png","xlarge":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.1152.1152.384,0,1536,1152.file/crossbeam_links.png","xxlarge":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.1152.1152.384,0,1536,1152.file/crossbeam_links.png","max":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_links.png/_jcr_content/renditions/original.image_file.1152.1152.384,0,1536,1152.file/crossbeam_links.png"})
ZEISS Crossbeam
Rivolto alla terza dimensione
La combinazione di microscopio elettronico a scansione (SEM) e fascio ionico focalizzato (FIB) consente di incidere in modo mirato il materiale sulla scala più piccola (gamma di nanometri) e di visualizzare direttamente la struttura del materiale sotto la superficie. Le applicazioni tipiche comprendono la localizzazione precisa e l’analisi chimica (EDX) dei difetti locali.
ZEISS Crossbeam per l’industria
Sperimenta una nuova qualità nell’analisi dei tuoi campioni.
![]({"xsmall":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original.image_file.100.100.file/crossbeam_family_key-visual.jpg","small":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original.image_file.360.360.file/crossbeam_family_key-visual.jpg","medium":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original.image_file.768.768.file/crossbeam_family_key-visual.jpg","large":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/crossbeam_family_key-visual.jpg","xlarge":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/crossbeam_family_key-visual.jpg","xxlarge":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/crossbeam_family_key-visual.jpg","max":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/crossbeam_family_key-visual.jpg/_jcr_content/renditions/original./crossbeam_family_key-visual.jpg"})
Prepara lamelle sottili da analizzare in TEM (microscopia elettronica a trasmissione) o STEM (microscopia elettronica a trasmissione a scansione). ZEISS Crossbeam offre una soluzione completa per la preparazione di lamelle TEM, anche in lotti.
Le prestazioni a bassa tensione della colonna FIB a scultura ionica supportano lamelle di alta qualità ed evitano l’amorfizzazione di campioni delicati. Utilizza un semplice flusso di lavoro per iniziare e attendi l’esecuzione automatica. Sfrutta il software di rilevamento degli endpoint che fornisce informazioni precise sullo spessore della lamella.
Il laser a femtosecondi opzionale viene utilizzato per l’ablazione del materiale e per migliorare l’accesso alle strutture più profonde, nonché per la preparazione di campioni di grandi dimensioni.
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I campi di applicazione in sintesi
- Sezioni trasversali locali, ad esempio in corrispondenza di siti difettosi (difetti di crescita di film sottili, corrosione, particelle intrappolate, ecc.)
- Preparazione delle lamelle TEM
- Indagini in sezione trasversale ad alta risoluzione in trasmissione (STEM)
- Tomografia 3D della microstruttura o dei difetti locali
- Lavorazione di strutture tramite rimozione mirata di materiale
Maggiori informazioni nei nostri video su ZEISS Crossbeam
![]({"xsmall":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.100.56.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg","small":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.360.203.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg","medium":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.768.432.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg","large":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.1024.576.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg","xlarge":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.1280.720.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg","xxlarge":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.1440.810.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg","max":"https://www.zeiss.it/content/dam/iqs/r/systems/industrial-microscopy/electron-microscopes/crossbeam/zeiss_laser-milled-trench_b_16_9.jpg/_jcr_content/renditions/original.image_file.1920.1080.0,0,2195,1235.file/zeiss_laser-milled-trench_b_16_9.jpg"})
Sovrapposizione della trincea fresata al laser sull’immagine al microscopio ottico della ROI; SEM, SESI, 450x.